OMedaSemi
Shanghai, 中国
Verified supplier · Last verified 17 Aug 2026
OMedaSemi (Shanghai Omedasemi Co., Ltd) was founded in 2021 by 3 doctors with over 10 years of nanofabrication experience. The company specializes in advanced nanofabrication services including photolithography, etching, coating, bonding, and two-photon 3D printing. With 15 employees and expertise across MEMS, photonics, and semiconductor processing, OMedaSemi supports 4/6/8-inch wafer fabrication with some equipment capable of 12-inch processing.
What makes them different
Proprietary expertise in two-photon polymerization 3D printing using Nanoscribe equipment (Photonics GT2 Pro, Quantum X) with 200nm horizontal and 400nm vertical feature resolution. Specialized capabilities in photonic wire bonding using Vanguard SONATA1000 equipment, ultra-low-loss silicon nitride thin films, ultra-high uniformity vacuum evaporation coatings (0.5%-1% uniformity at 8 inches), and composite wafer fabrication (SiCOI, LNOI, LTOI, GaNOI) using surface-activated bonding and SmartCut processes.
Industries served
- Photonics & Optoelectronics
- MEMS Sensors
- Microfluidics
- Nano-optics
- Photonic Integrated Circuits
- Micro LED
- Power Devices
- Semiconductor Heterogeneous Integration
- Quantum Optics
- Laser Frequency Conversion
Capacity
15 employees. Equipment supports 4/6/8-inch wafer processing with some systems capable of 12-inch wafers. Two-photon printing maximum size: 500µm × 500µm with 300µm maximum height. Multiple lithography systems: EVG 620NT contact lithography (0.8µm minimum linewidth), Canon FPA-3030EX6 stepper (150nm minimum linewidth), Heidelberg DWL66+ laser direct writing (300nm minimum feature), JEOL JBX-9500FS electron beam lithography (10nm exposure resolution). LPCVD and PECVD coating lines for 2-12 inch wafers. High-volume production capability for wafer coatings.
Materials
- Resin
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